PCB Capability
| Item | Parameter | |
| Min.Line Width | 0.125 mm | |
| Min.Line Spacing | 0.125 mm | |
| Min.Annular Ring Width | 0.2 mm | |
| Min.Hole Diameter | 0.2 mm | |
| NO.of Layers | 1-8 Layers | |
| Base Material | DS | 0.2 mm - 3.0 mm |
| MLB | 0.45 mm - 6.0 mm | |
| Board Size | DS | 600 × 800 mm |
| MLB | 550 × 800 mm | |
| Hole Dia.Tolerance | NPTH | ±0.05 mm |
| PTH | ±0.076 mm | |
| Hole to Hole Tolerance | ±0.076 mm | |
| Outline Tolerance | ±0.13 mm | |
| PTH Wall Copper Thickness | 0.025 mm | |
| Insulation Resistance | 1012Ω (Normal) | |
| Peel off Strength | 1.4 N/mm | |
| Thermal shock Resistance | 260℃ 20Second(260℃ 20Seconds) | |
| Solder Mask Hardness | ≥6H | |
| Flammability Rate | 94V-0 | |
| Test Voltage | 10V-250V | |
| Warp and Twist | ≤1% | |
| Quality Standard | GB4588.2;GB4588.4;IPC600E | |
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粤ICP备 06082937号